Permabond ES560
PERMABOND® ES560 is a one-part epoxy adhesive that flows when heated.
Internal reference:
49-560.FL
HS code:
3506.9190000
PERMABOND® ES560 is a one-component epoxy adhesive that flows freely when heated during curing. It is unfilled and self-leveling, making it particularly suitable for potting in electronics and encapsulation applications, as well as for underfilling microchips. ES560 offers excellent impact resistance and withstands thermal cycling.
product specifications
| Physical properties | |
|---|---|
| Color | transparent |
| Chemical group | epoxy resin |
| Viscosity (adhesives) | Medium viscosity 500 - 5000 mPas |
| Viscosity mPa·s | 1000-3000 |
| Specific gravity | 1.2 |
| product information | |
|---|---|
| manufacturer | Permabond Engineering Adhesives Ltd |
| brand | Permabond |
| container | 200 ml |
| country of origin | Italy |
| Operating temperature (°C) | -40 to +150 |
| Storage temperature (°C) | 2-7 |
| UFI (Unique Formula Identifier) | K7Y0-30EN-J00M-H49N |
| Mechanical properties | |
|---|---|
| Hardness (Shore D) | 80 |
| Shear strength ISO ISO4587 in N/mm² | |
|---|---|
| steel | Steel 14 - 20 N/mm² |
| curing values | |
|---|---|
| Maximum gap width (mm) | 0.1 |
| Performance at ultimate strength | |
|---|---|
| thermal conductivity | 0.1 W/(m.K) |
| thermal expansion coefficient | 45 x 10⁻⁶ mm/mm/°C |
| dielectric constant | 4,5 |
| dielectric strength | 22 kV/mm |
| Properties of permanent bonding | |
|---|---|
| Peel resistance (ISO 4578) | 40 N/ 25 mm |
| Uncategorized | |
|---|---|
| TG value | 240°F |
| Curing speed (induction) | <3 Minuten |
| keywords | |
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