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Bluesil RTV 141 B

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BLUESIL® RTV 141 B – Catalyst component for highly transparent silicone potting compounds

BLUESIL® RTV 141 B is the reliable B-component for highly transparent, insulating potting applications—ideal for light-sensitive systems and precise electronics protection solutions.
Catalyst for the 2K silicone system RTV 141 – ensures bubble-free curing of crystal-clear silicone potting applications.
Reactive B component for the RTV 141 system – for optically clear, elastic embeddings with excellent insulation.

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Electrical insulation LED encapsulation Electronics encapsulation Addition-curing Optoelectronic encapsulation Bubble-free Bluesil RTV 141 B Catalyst transparent
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Terms and Conditions

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Internal reference: 40-901

Product description

BLUESIL® RTV 141 B is the B component of the highly transparent two-component silicone system RTV 141, which was specially developed for use in optical, electrical, and sensory potting applications. When combined with BLUESIL® RTV 141 A, it produces an addition-curing, elastic silicone with very good electrical insulation, high optical clarity, and excellent temperature resistance. RTV 141 B is used in a mixing ratio of 1:10 to RTV 141 A and enables safe and homogeneous curing—at room temperature or accelerated by heat. The system is ideal for light-conducting components, sensitive electronics, and transparent protective potting solutions.

product features

  • Catalyst component for RTV 141 A

  • Addition cross-linking – no shrinkage, no by-products

  • Color: transparent

  • Mixing ratio: 100 parts RTV 141 A + 10 parts RTV 141 B (by weight)

  • Processing at room temperature or thermally accelerated

  • End product: crystal clear, elastic, insulating

  • Temperature range: –70 °C to +200 °C

  • Refractive index: approx. 1.406

  • Viscosity: medium viscosity – easy to dispense

  • Suitable for vacuum processing

  • Can be stored for long periods when stored properly

Suitable partner products

  • BLUESIL® RTV 141 A – transparent A component

  • Primer PBM 821 – optional for improving adhesion on smooth substrates

Typical areas of application

  • Optoelectronic components

  • LED and sensor encapsulation

  • Embedding of light-conducting fibers

  • Electronic assemblies requiring transparency

  • Protective coatings for circuit boards and microelectronics

  • Insulating casting compounds in the industrial sector

Processing instructions

  1. Stir components A and B separately until well blended.

  2. Mixing ratio: 100:10 (A:B) must be strictly adhered to

  3. Carefully homogenize the mixture – avoid air bubbles

  4. Vacuum ventilation recommended for visually perfect results

  5. Curing:

    • 24–48 hours at room temperature

    • or accelerated: 4 hours at 60°C / 2 hours at 100°C / 1 hour at 150°C

  6. Demolding only after complete cross-linking

  7. No contact with materials containing tin, amines, or sulfur

  8. Storage: cool, dry, sealed airtight